3M Anisotropic Conductive Film Product Selection Guide

This slideshow is intended to help the customer choose the appropriate 3M™ Anisotropic Conductive Film (ACF) adhesive product for the job. The data included in this
graphic compare the important physical properties of the products. This product selection guide is to be used to look at the variety of products available and decide on the proper ACF (or ACFs) to each application. In the end it's best to test the application using the particular AFC product. 3M provides a variety of high-performance anisotropic conductive film adhesive products used to mechanically and electrically connect flex circuits and other components to a variety of substrates. These reliable, technologies can replace soldering and mechanical fasteners in many applications, helping to hasten assembly time and lessen space requirements.

3M™ Anisotropic Conductive Film Adhesives (ACF) are based on adhesive designs that are categorized into four product families. These categories include pressure sensitive adhesives (PSA), thermoplastic materials, thermoset materials, and a combination of a PSA and thermoset. The following graphics show these different product families and the grouping of products within each and showing a general comparison of performance ranking and process simplicity is added showing one level of trade-off necessary in the product selection process.

The following descriptions provide general, high-level, key product characteristics for
the individual 3M ACFs.

• 3M Film 5363 - Flex-to-Board (or -to-Flex) excellent reliability with polyimide flex, 200μm pitch, 200°C bond temperature, 10 sec bond cycle, high peel strength, max use temperature 125°C.

• 3M Film 7379 - Flex-to-Glass (or -to-Flex) Thermo-set low temperature cure. High adhesion to PET. Good thermal stability. 3M recommends that users consider testing 5363 for improved results.

• 3M Film 7303 - Flex-to-Board (or -to-Flex) ideal for polyester flex, 135°C bond temperature, 500μm pitch, stable interconnect resistance, max use temperature 80°C.

• 3M Film 7371 - Flex-to-Flex, Flex-to-Glass, Flex-to-PET. Slight tack at room temperature. High adhesion to PET. Fast bond time.

• 3M Film 7371-20 - Flex-to-Flex, Flex-to-Glass, Flex-to-PET. Slight tack at room temperature. High adhesion to PET. Fast bond time. 20 micron particle size.

• 3M Film 7376-10 - Flex to Camera Module, Flex to Flex, Flex to PET. An acrylate-based adhesive system filled with 10 micron gold-coated polymer particles.

• 3M Film 7376-30 - Flex to Camera Module, Flex to Flex, Flex to PET. An acrylate-based adhesive system filled with 30 micron gold-coated polymer particles.

• 3M Film 9703/9705 - Flex-to-Board (or -to-Flex) PSA rapid bond, coarse pitch, max use temperature 70°C, (additional pressure support necessary for some applications).

	Application	Bonding Temperature (°C)	Bonding Time (sec)	Bonding Pressure (MPa)	Particle Diameter (μ)	Adhesive Thickness (μ)	Pitch Minimum (μ)	Minimum Pad Area (sq mm)	Connection Resistance (mOhms)	90° Peel Adhesion (g/cm)	Temp/Humidity Aging (°C/%rh)	Temp Cycling (°C)
ACF 5363	Flex to Flex, Flex to PCB	190 - 210	10	3 - 5	10	40	200	0.15	<100	<700
ACF 7371	Flex on Plastic/Glass	140 - 170	10 - 15	1-2	10	25	200	0.2	<100	<700	85/85	-40 to 85
ACF 7303	Flex to Flex, Flex to PCB	135 - 150	25	2	43	74	500	0.75	<200	<500
ACF 7371-20	Touch panel	140 - 170	10 - 15	1-2	20	35	500	0.5	<20	<600	85/85	-40 to 85
ACF 7376-10	Camera module	140 - 160	7 - 15	1-2	10	40	200	0.1	<20	<900	85/85	-40 to 85
ACF 7376-30	Camera module	140 - 160	7 - 15	1-2	30	45	500	0.5	<20	<700	85/85	-40 to 85
ACF 7379	Glass	160 - 190	10 - 20	1-2	10	25	100	0.05	<3000	<700	85/85	-40 to 85
ACF 9703/9705	EMI/EMC Applications	15 - 70		0.10		50	800	3.2			60/95	-40 to 85

	Flex Type			Connection Type
	Silver Ink on Polyester	Gold/Copper on Polyester	Gold/Copper on Polyimide	Flex to Glass	Flex to Plastic Device	Flex to PCB	Flex to Flex
ACF 5363			x			x	x
ACF 7303	x	x	x		x	x	x
ACF 7371	x	x	x		x		x
ACF 7371-20	x	x	x		x		x
ACF 7376-10	x	x	x		x	x	x
ACF 7376-30	x	x	x		x	x	x
ACF 7379	x	x	x
ACF 9703/9705				x		x	x

Design requirements have been used in the development of these 3M™ Anisotropic Conductive Film Adhesive products. The products were developed for use in a wide range of applications. The following graphics and table offer some guidelines useful in choosing the correct product.

3M™ Anisotropic Conductive Film (ACF) 5363 is a electrically conductive, heat-bondable adhesive film. At room temperature the unbonded film is non-tacky and consists of a thermoset-thermoplastic adhesive matrix filled with conductive particles. These particles provide inter-connection of circuit lines through the adhesive thickness, but are spaced a certain distance apart for the product to be electrically insulating in the plane of the adhesive. Heat and pressure causes the adhesive to flow and to bring the circuit pads into electrical contact by trapping the conductive particles. The adhesive cures quickly at modest bonding temperature. The 3M ACF 5363 may be used in bonding a flexible printed circuit to another flexible printed circuit or to a printed circuit board.

Features and Benefits

Heat cure
Fast bond time
Thermo-set high temperature cure
Excellent chemical resistance
Highest thermal stability
Replaces solder for lead-free solution
Frozen storage

Product Attributes

Adhesive Thickness (metric)	40 micron
Adhesive Type	Thermoset Epoxy
Application	Electronic Component Bonding, Flex Bonding
Application Category	Bonding
Bonding Method	Thermo-compression bonding
Bonding Pressure	3 - 5 MPa
Bonding Temperature	190 - 210 degree C
Bonding Time	10 seconds
Conductive Particle Size	10 Micron
Conductive Particle Type	Gold-coated Ni
Connection Type	Flex to Flex, Flex to PCB
Flex Type	Gold/Copper on Polyimide
Liner Thickness (metric)	50 micron
Liner Type	Polyester Film with Silicone Release
Minimum Gap	4 mil
Minimum Gap (metric)	100 micron
Minimum Overlap Area	0.15 mm^2
Minimum Pitch	8 mil
Minimum Pitch (metric)	200 Micron
Product Form	Roll
Product Series	5363
Shelf Life	4 Weeks
Shelf Life Frozen	15 Months
Standard Width (metric)	1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm
Tacking Pressure	0.1 - 1.5 MPa
Tacking Temperature	90 - 110 degree C
Tacking Time	1 - 2 seconds
Total Trace Height (metric)	75 micron

3M™ Anisotropic Conductive Film (ACF) Adhesive 7303 is a electrically conductive, heat-bondable adhesive film. It is tacky at room temperature and is made of a thermosetting epoxy/acrylate adhesive matrix filled with conductive particles. These particles allow interconnection of circuit lines through the adhesive after bonding, but are distanced apart for the product to be electrically insulating. Heat and pressure causes the adhesive to flow and bring the circuit pads into electrical contact by trapping the conductive particles. The thermoset quickly cures. ACF 7303 can be used in bonding a flexible printed circuit to another flexible printed circuit or to a printed circuit board.

Features and Benefits

Heat cure
Thermo-set low temperature cure
Tacky at room temperature
Good thermal stability
Reworkable
Frozen storage

Product Attributes

Adhesive Thickness (metric)	74 micron
Adhesive Type	Epoxy/Acrylate Blend
Application	Electronic Component Bonding, Flex Bonding
Application Category	Bonding
Bonding Method	Thermo-compression bonding
Bonding Pressure	2 MPa
Bonding Temperature	135 - 150 degree C
Bonding Time	25 seconds
Conductive Particle Size	43 Micron
Conductive Particle Type	Silver-coated glass
Connection Type	Flex to Flex, Flex to PCB
Flex Type	Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester
Liner Thickness (metric)	100 micron
Liner Type	Polyester-coated Kraft with Silicone Release
Minimum Gap	10 mil
Minimum Gap (metric)	250 micron
Minimum Overlap Area	0.75 mm^2
Minimum Pitch	20 mil
Minimum Pitch (metric)	500 Micron
Product Form	Roll
Product Series	7303
Shelf Life	9 Months
Shelf Life Frozen	18 Months
Standard Width (metric)	2.5 mm, 3.0 mm, 4.0 mm, 5.0 mm
Tacking Pressure	0.1 - 1.5 MPa
Tacking Temperature	25 degree C
Tacking Time	1 - 2 seconds
Total Trace Height (metric)	140 micron

3M™ Anisotropic Conductive Film (ACF) Adhesive 7378 is a electrically conductive, heat-bondable adhesive film. It is tacky at room temperature and is made of a thermosetting epoxy/acrylate adhesive matrix filled with conductive particles. These particles allow interconnection of circuit lines through the adhesive after bonding, but are distanced apart for the product to be electrically insulating. Heat and pressure causes the adhesive to flow and bring the circuit pads into electrical contact by trapping the conductive particles. The thermoset quickly cures. ACF 7378 can be used in bonding a flexible printed circuit to another flexible printed circuit or to a printed circuit board.

Features and Benefits

Heat cure
Thermo-set low temperature cure
Tacky at room temperature
Good thermal stability
Reworkable
Frozen storage

Product Attributes

Adhesive Thickness (metric)	40 micron
Adhesive Type	Epoxy/Acrylate Blend
Application	Electronic Component Bonding, Flex Bonding
Application Category	Bonding
Bonding Method	Thermo-compression bonding
Bonding Pressure	3-4 MPa
Bonding Temperature	160 - 180 degree C
Bonding Time	5-9 seconds
Conductive Particle Size	10 Micron
Conductive Particle Type	Silver-coated glass
Connection Type	Flex to Flex, Flex to PCB
Flex Type	Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester
Liner Thickness (metric)	100 micron
Liner Type	Polyester-coated Kraft with Silicone Release
Minimum Gap	10 mil
Minimum Gap (metric)	250 micron
Minimum Overlap Area	0.2 mm^2
Minimum Pitch	20 mil
Minimum Pitch (metric)	200 Micron
Product Form	Roll
Product Series	7378
Shelf Life	9 Months
Shelf Life Frozen	18 Months
Standard Width (metric)	2.5 mm, 3.0 mm, 4.0 mm, 5.0 mm
Tacking Pressure	0.1 - 1.5 MPa
Tacking Temperature	25 degree C
Tacking Time	1 - 2 seconds
Total Trace Height (metric)	140 micron

3M™ Anisotropic Conductive Film (ACF) Adhesive 5552R is a electrically conductive, heat-bondable adhesive film. It is tacky at room temperature and is made of a thermosetting epoxy/acrylate adhesive matrix filled with conductive particles. These particles allow interconnection of circuit lines through the adhesive after bonding, but are distanced apart for the product to be electrically insulating. Heat and pressure causes the adhesive to flow and bring the circuit pads into electrical contact by trapping the conductive particles. The thermoset quickly cures. ACF 5552R can be used in bonding a flexible printed circuit to another flexible printed circuit or to a printed circuit board.

Features and Benefits

Heat cure
Thermo-set low temperature cure
Tacky at room temperature
Good thermal stability
Reworkable
Frozen storage

Product Attributes

Adhesive Thickness (metric)	19 micron
Adhesive Type	Epoxy/Acrylate Blend
Application	Electronic Component Bonding, Flex Bonding
Application Category	Bonding
Bonding Method	Thermo-compression bonding
Bonding Pressure	2-4 MPa
Bonding Temperature	170 - 190 degree C
Bonding Time	20-30 seconds
Conductive Particle Size	6 Micron
Conductive Particle Type	Silver-coated glass
Connection Type	Flex to Flex, Flex to PCB
Flex Type	Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester
Liner Thickness (metric)	100 micron
Liner Type	Polyester-coated Kraft with Silicone Release
Minimum Gap	10 mil
Minimum Gap (metric)	250 micron
Minimum Overlap Area	0.2 mm^2
Minimum Pitch	20 mil
Minimum Pitch (metric)	100 Micron
Product Form	Roll
Product Series	5552R
Shelf Life	9 Months
Shelf Life Frozen	18 Months
Standard Width (metric)	2.5 mm, 3.0 mm, 4.0 mm, 5.0 mm
Tacking Pressure	0.1 - 1.5 MPa
Tacking Temperature	25 degree C
Tacking Time	1 - 2 seconds
Total Trace Height (metric)	140 micron

3M™ Anisotropic Conductive Film (ACF) 7371 is a electrically conductive, heat-bondable adhesive film. The unbonded film is slightly tacky at room temperature and consists of a thermoset-elastomer and thermoplastic adhesive matrix filled with conductive particles. These particles provide interconnection of circuit lines through the adhesive, but are spaced so that the product to be electrically insulating. Application of heat and pressure causes the adhesive to flow and to bring the circuit pads into contact by trapping the conductive particles. The adhesive rapidly cross-links at modest bonding temperature and pressure. 3M ACF 7371 is used in bonding a flexible printed circuit to another flexible printed circuit or to a plastic touch screen or plastic flat panel display device.

Features and Benefits

Heat cure
Fast bond time
Thermo-set low temperature cure
Slight tack at room temperature
High adhesion to PET
Good thermal stability
Reworkable
Frozen storage

Product Attributes

Adhesive Thickness (metric)	25 micron
Adhesive Type	Acrylate-Based
Application	Display Bonding, Touch Panel Bonding
Application Category	Bonding
Bonding Method	Thermo-compression bonding
Bonding Pressure	1 - 2 MPa
Bonding Temperature	140 - 170 degree C
Bonding Time	10 - 15 seconds
Conductive Particle Size	10 Micron
Conductive Particle Type	Gold-coated polymer
Connection Type	Flex to Flex, Flex to Glass, Flex to PET
Flex Type	Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester
Liner Thickness (metric)	50 micron
Liner Type	Polyester Film with Silicone Release
Minimum Gap	4 mil
Minimum Gap (metric)	100 micron
Minimum Overlap Area	0.10 mm^2
Minimum Pitch	8 mil
Minimum Pitch (metric)	200 Micron
Product Form	Roll
Product Series	7371
Shelf Life	4 Weeks
Shelf Life Frozen	12 Months
Standard Width (metric)	1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm
Tacking Pressure	0.1 - 1.5 MPa
Tacking Temperature	60 - 90 degree C
Tacking Time	1 - 2 seconds
Total Trace Height (metric)	50 micron

3M™ Anisotropic Conductive Film (ACF) 7379 is a heat-bondable, electrically conductive adhesive film. The pre-bonded film is tacky at room temp and consists of a thermoset-elastomer and thermoplastic adhesive matrix loaded with conductive particles. These particles allow connection of circuit lines through the adhesive, but are spaced apart for the product to be electrically insulating. Application of heat and pressure causes the adhesive to flow and to bring the circuit pads into contact by pinning the conductive particles. The adhesive cross-links rapidly at modest bonding temperature and pressure. The 3M ACF 7379 can be used in bonding a flexible printed circuit to glass-based devices such as displays or to another flexible printed circuit.

Features and Benefits

Heat cure
Thermo-set low temperature cure
Slight tack at room temperature
High adhesion to PET
Good thermal stability
Reworkable
Frozen storage

Product Attributes

Adhesive Thickness (metric)	25 micron
Adhesive Type	Acrylate-Based
Application	Display Bonding
Application Category	Bonding
Bonding Method	Thermo-compression bonding
Bonding Pressure	2 - 3 MPa
Bonding Temperature	160 - 190 degree C
Bonding Time	10 - 20 seconds
Conductive Particle Size	10 Micron
Conductive Particle Type	Gold-coated polymer
Connection Type	Flex to Glass
Flex Type	Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester
Liner Thickness (metric)	50 micron
Liner Type	Polyester Film with Silicone Release
Minimum Gap	2 mil
Minimum Gap (metric)	50 micron
Minimum Overlap Area	0.05 mm^2
Minimum Pitch	4 mil
Minimum Pitch (metric)	100 Micron
Product Form	Roll
Product Series	7379
Shelf Life	4 Weeks
Shelf Life Frozen	15 Months
Standard Width (metric)	1.5 mm, 2.0 mm, 3.0 mm
Tacking Pressure	0.1 - 1.5 MPa
Tacking Temperature	60 - 90 degree C
Tacking Time	1 - 2 seconds
Total Trace Height (metric)	50 micron

3M™ Anisotropic Conductive Film (ACF) 7393 is a electrically conductive, heat-bondable adhesive film. The unbonded film is sticky at room temperature and is made of of a thermoset-elastomer and thermoplastic adhesive matrix packed with conductive particles. These particles allow interconnection of circuits through the adhesive, but are distanced apart for the product to be electrically insulating. Heat and pressure causes the adhesive to flow and to bring the circuit pads into electrical contact by pinning the conductive particles.The adhesive cross-links quickly at modest bonding temperature and pressure. The 3M ACF 7393 is used in bonding a flexible printed circuit to another flexible printed circuit or flexible printed circuit to polyester-based devices or flexible printed circuit to camera module devices.

Features and Benefits

Heat cure
Fast bond time
Thermo-set low temperature cure
Slight tack at room temperature
High adhesion to PET
Good thermal stability
Reworkable
Frozen storage

Product Attributes

Adhesive Thickness (metric)	25 micron
Adhesive Type	Acrylate-Based
Application	Camera Module Assembly
Application Category	Bonding
Bonding Method	Thermo-compression bonding
Bonding Pressure	1 - 2 MPa
Bonding Temperature	150 - 170 degree C
Bonding Time	10 - 20 seconds
Conductive Particle Size	10 Micron
Conductive Particle Type	Gold-coated polymer
Connection Type	Flex to Camera Module, Flex to Flex, Flex to PET
Flex Type	Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester
Liner Thickness (metric)	50 micron
Liner Type	Polyester Film with Silicone Release
Minimum Gap	2.5 mil
Minimum Gap (metric)	70 micron
Minimum Overlap Area	0.10 mm^2
Product Form	Roll
Product Series	7393
Shelf Life	4 Weeks
Shelf Life Frozen	12 Months
Standard Width (metric)	1.5 mm, 2.0 mm, 5.5 mm, 6.5 mm, 8.0 mm
Tacking Pressure	0.1 - 1.5 MPa
Tacking Temperature	60 - 90 degree C
Tacking Time	1 - 2 seconds
Total Trace Height (metric)	75 micron

3M™ Electrically Conductive Adhesive Transfer Tape 9703 is a pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. The PSA matrix is loaded with conductive particles which allow interconnection between circuits through the adhesive (the “Z-axis”) but are distanced enough apart for the product to be electrically insulating. 9703 ia easy to use in assembly operations. Tape 9703 electrically connects and bonds medium pitch flexible circuits with other flexible circuits (flex), rigid printed circuit boards (PCB) or LCD screens. 9703 offers great connection to common PCB substrates such as copper, gold, FR-4 epoxy, Kapton™ polyimide and polyester films. Stable electrical performance in any flexible circuit interconnection application may require mechanical reinforcement (clamping). Tape 9703 also electrically connects and mechanically bonds EMI/RFI shield and gaskets to metal frames and enclosures. The low contact resistance and tape construction result in good EMI performance. Tape 9703 can be applied as die cut parts or in roll form and has good adhesion to common EMI/RFI substrates such as aluminum, stainless steel, and smooth gasket materials.

Features and Benefits

Low outgassing acrylic adhesive
Anisotropic Z-axis electrical conductivity
PSA tack properties
Thermal curing not required
Easy to use in assembly operations
Can be applied as die-cut parts or in roll form

Product Attributes

Adhesive Thickness (metric)	50 micron
Adhesive Type	Conductive Acrylic
Application	Antenna Bonding (with Grounding), EMI Shielding (with Grounding), Flex Bonding, Flex Bonding (with Grounding), Flex Stiffener Bonding (with Grounding), Grounding, Metal to Metal Bonding (with Grounding), Static Dissipation
Application Category	Bonding, EMI/EMC Applications
Bonding Method	Finger pressure or roller bar
Bonding Pressure	0.10 MPa
Bonding Temperature	15 - 70 Degree C
Conductive Particle Type	Silver-coated nickel
Conductivity Direction	Z-Axis Conductive
Conductivity Filler Type	Particle
Connection Type	Flex to Flex, Flex to LCD, Flex to PCB
Length	108 yd, 36 yd
Liner Thickness (metric)	100 micron
Liner Type	Silicone Treated Polycoated Kraft Paper (PCK)
Minimum Gap	15 mil
Minimum Gap (metric)	400 micron
Minimum Overlap Area	3.2 mm^2
Minimum Pitch	32 mil
Minimum Pitch (metric)	800 Micron
Product Form	Roll
Product Series	9703
Shelf Life	24 Months @ 21 Degree C and 50% RH
Total Tape Thickness without Liner	2.0 mil
Total Tape Thickness without Liner (metric)	0.05 mm

3M™ Electrically Conductive Adhesive Transfer Tape (ECATT) 9705 is a pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. The PSA matrix is loaded with conductive particles which provide connection between conductive materials through the adhesive(the “Z-axis”) but are distanced apart for the product to be electrically insulating in the plane of the adhesive. Tape 9705 electrically connects and adhesively bonds medium pitch flexible circuits with other flexible circuits (flex),

rigid printed circuit boards (PCB) or LCD screens. Stable electrical performance in any flexible circuit

interconnection application may require added mechanical reinforcement (clamping or compressing) in the bond area.

The PSA tack properties and lack of any thermal curing make Tape 9705 easy to use in assembly operations. Tape 9705 offers good adhesion to common PCB substrates such as

copper, gold, FR-4 epoxy, Kapton™ polyimide and polyester films.

Tape 9705 can be applied as die cut parts or in

roll form and has good adhesion to common EMI/RFI substrates such as copper, stainless steel, and smooth gasket materials.

Tape 9705 also electrically connects and adhesively bonds EMI/RFI shield and gaskets to metal frames and enclosures. The

low contact resistance and tape construction result in good EMI performance.

Features and Benefits

Standard outgassing version of Tape 9703
Standard adhesion acrylic adhesive
Anisotropic Z-axis electrical conductivity
PSA tack properties
Thermal curing not required
Can be applied as die-cut parts or in roll form
Easy to use in assembly operations

Product Attributes

Adhesive Thickness (metric)	50 micron
Adhesive Type	Conductive Acrylic
Application	Antenna Bonding (with Grounding), EMI Shielding (with Grounding), Flex Bonding, Flex Bonding (with Grounding), Flex Stiffener Bonding (with Grounding), Grounding, Metal to Metal Bonding (with Grounding), Static Dissipation
Application Category	Bonding, EMI/EMC Applications
Bonding Method	Finger pressure or roller bar
Bonding Pressure	0.03 - 0.10 MPa
Bonding Temperature	20 - 35 Degree C
Conductive Particle Type	Silver-coated filler
Conductivity Direction	Z-Axis Conductive
Conductivity Filler Type	Particle
Connection Type	Flex to Flex, Flex to LCD, Flex to PCB
Length	108 yd, 36 yd
Liner Thickness (metric)	100 micron
Liner Type	Silicone Treated Polycoated Kraft Paper (PCK)
Minimum Gap	15 mil
Minimum Gap (metric)	400 micron
Minimum Overlap Area	3.2 mm^2
Minimum Pitch	32 mil
Minimum Pitch (metric)	800 Micron
Product Form	Roll
Product Series	9705
Shelf Life	24 Months @ 21 Degree C and 50% RH
Total Tape Thickness without Liner	2.0 mil
Total Tape Thickness without Liner (metric)	0.05 mm

3M™ Anisotropic Conductive Film (ACF) 7376-30 is a electrically conductive, heat-bondable adhesive film.The unbonded film is slightly tacky at room temperature and is made of a thermoset-thermoplastic adhesive matrix filled with conductive particles.These particles provide connection of circuit lines through the adhesive thickness, but are spaced far enough apart for the product to be electrically insulating. Application of heat and pressure causes the adhesive to flow and to connect the circuit pads by pinning the conductive particles. The adhesive sets rapidly at modest bonding temperature and pressure. The 3M ACF 7376-30 is used to bond a flexible printed circuit to another flexible printed circuit or flexible printed circuit to polyester-based devices or flexible printed circuit to camera module devices.

Features and Benefits

Heat cure
Fast bond time
Thermo-set low temperature cure
Slight tack at room temperature
30 micron particle size
High adhesion to PET
Good thermal stability
Reworkable
Frozen storage

Product Attributes

Adhesive Thickness (metric)	45 micron
Adhesive Type	Acrylate-Based
Application	Camera Module Assembly
Application Category	Bonding
Bonding Method	Thermo-compression bonding
Bonding Pressure	1 - 2 MPa
Bonding Temperature	140 - 160 degree C
Bonding Time	7 - 15 seconds
Conductive Particle Size	30 Micron
Conductive Particle Type	Gold-coated polymer
Connection Type	Flex to Camera Module, Flex to Flex, Flex to PET
Flex Type	Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester
Liner Thickness (metric)	50 micron
Liner Type	Polyester Film with Silicone Release
Minimum Gap	4 mil
Minimum Gap (metric)	100 micron
Minimum Overlap Area	0.50 mm^2
Product Form	Roll
Product Series	7376-30
Shelf Life	4 Weeks
Shelf Life Frozen	12 Months
Standard Width (metric)	2.0 mm, 5.0 mm, 6.5 mm
Tacking Pressure	0.1 - 1.5 MPa
Tacking Temperature	60 - 90 degree C
Tacking Time	1 - 2 seconds
Total Trace Height (metric)	75 micron

3M™ Anisotropic Conductive Film (ACF) 7376-10 is a electrically conductive, heat-bondable adhesive film. The unbonded film is sticky at room temperature and is made of of a thermoset-elastomer and thermoplastic adhesive matrix packed with conductive particles. These particles allow interconnection of circuits through the adhesive, but are distanced apart for the product to be electrically insulating. Heat and pressure causes the adhesive to flow and to bring the circuit pads into electrical contact by pinning the conductive particles.The adhesive cross-links quickly at modest bonding temperature and pressure. The 3M ACF 7376-10 is used in bonding a flexible printed circuit to another flexible printed circuit or flexible printed circuit to polyester-based devices or flexible printed circuit to camera module devices.

Features and Benefits

Heat cure
Fast bond time
Thermo-set low temperature cure
Slight tack at room temperature
High adhesion to PET
Good thermal stability
Reworkable
Frozen storage

Product Attributes

Adhesive Thickness (metric)	40 micron
Adhesive Type	Acrylate-Based
Application	Camera Module Assembly
Application Category	Bonding
Bonding Method	Thermo-compression bonding
Bonding Pressure	1 - 2 MPa
Bonding Temperature	140 - 160 degree C
Bonding Time	7 - 15 seconds
Conductive Particle Size	10 Micron
Conductive Particle Type	Gold-coated polymer
Connection Type	Flex to Camera Module, Flex to Flex, Flex to PET
Flex Type	Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester
Liner Thickness (metric)	50 micron
Liner Type	Polyester Film with Silicone Release
Minimum Gap	2.5 mil
Minimum Gap (metric)	70 micron
Minimum Overlap Area	0.10 mm^2
Product Form	Roll
Product Series	7376-10
Shelf Life	4 Weeks
Shelf Life Frozen	12 Months
Standard Width (metric)	1.5 mm, 2.0 mm, 5.5 mm, 6.5 mm, 8.0 mm
Tacking Pressure	0.1 - 1.5 MPa
Tacking Temperature	60 - 90 degree C
Tacking Time	1 - 2 seconds
Total Trace Height (metric)	75 micron

3M™ Anisotropic Conductive Film (ACF) 7376-20 is a electrically conductive, heat-bondable adhesive film. The unbonded film is sticky at room temperature and is made of of a thermoset-elastomer and thermoplastic adhesive matrix packed with conductive particles. These particles allow interconnection of circuits through the adhesive, but are distanced apart for the product to be electrically insulating. Heat and pressure causes the adhesive to flow and to bring the circuit pads into electrical contact by pinning the conductive particles.The adhesive cross-links quickly at modest bonding temperature and pressure. The 3M ACF 7376-20 is used in bonding a flexible printed circuit to another flexible printed circuit or flexible printed circuit to polyester-based devices or flexible printed circuit to camera module devices.

Features and Benefits

Heat cure
Fast bond time
Thermo-set low temperature cure
Slight tack at room temperature
High adhesion to PET
Good thermal stability
Reworkable
Frozen storage

Product Attributes

Adhesive Thickness (metric)	35 micron
Adhesive Type	Acrylate-Based
Application	Camera Module Assembly
Application Category	Bonding
Bonding Method	Thermo-compression bonding
Bonding Pressure	1 - 2 MPa
Bonding Temperature	140 - 160 degree C
Bonding Time	7 - 15 seconds
Conductive Particle Size	20 Micron
Conductive Particle Type	Gold-coated polymer
Connection Type	Flex to Camera Module, Flex to Flex, Flex to PET
Flex Type	Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester
Liner Thickness (metric)	50 micron
Liner Type	Polyester Film with Silicone Release
Minimum Gap	2.5 mil
Minimum Gap (metric)	70 micron
Minimum Overlap Area	0.10 mm^2
Product Form	Roll
Product Series	7376-20
Shelf Life	4 Weeks
Shelf Life Frozen	12 Months
Standard Width (metric)	1.5 mm, 2.0 mm, 5.5 mm, 6.5 mm, 8.0 mm
Tacking Pressure	0.1 - 1.5 MPa
Tacking Temperature	60 - 90 degree C
Tacking Time	1 - 2 seconds
Total Trace Height (metric)	75 micron

3M™ Anisotropic Conductive Film (ACF) 7371-20 is a electrically conductive, heat-bondable adhesive film. It is has tack at room temperature and consists of a thermoset-thermoplastic adhesive matrix randomly loaded with conductive particles. These particles allow interconnection of circuits through the adhesive, but are distanced apart for the product to be electrically insulating. Heat and pressure causes the adhesive to flow and to bring the circuit pads into electrical contact by trapping the conductive particles. The adhesive cures fast at modest bonding temperature and pressure. The 3M ACF 7371-20 is used in bonding a flexible printed circuit to another flexible printed circuit or flexible printed circuit to polyester-based devices or flexible printed circuit to camera module devices.

Features and Benefits

Heat cure
Fast bond time
Thermo-set low temperature cure
Slight tack at room temperature
20 micron particle size
High adhesion to PET
Good thermal stability
Reworkable
Frozen storage

Product Attributes

Adhesive Thickness (metric)	35 micron
Adhesive Type	Acrylate-Based
Application	Touch Panel Bonding
Application Category	Bonding
Bonding Method	Thermo-compression bonding
Bonding Pressure	1 - 2 MPa
Bonding Temperature	140 - 160 degree C
Bonding Time	10 - 15 seconds
Conductive Particle Size	20 Micron
Conductive Particle Type	Gold-coated polymer
Connection Type	Flex to Flex, Flex to Glass, Flex to PET
Flex Type	Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester
Liner Thickness (metric)	50 micron
Liner Type	Polyester Film with Silicone Release
Minimum Gap	4 mil
Minimum Gap (metric)	100 micron
Minimum Overlap Area	0.50 mm^2
Minimum Pitch	8 mil
Minimum Pitch (metric)	200 Micron
Product Form	Roll
Product Series	7371-20
Shelf Life	4 Weeks
Shelf Life Frozen	12 Months
Standard Width (metric)	1.0 mm, 1.5 mm, 2.0 mm, 3.0 mm
Tacking Pressure	0.1 - 1.5 MPa
Tacking Temperature	60 - 90 degree C
Tacking Time	1 - 2 seconds
Total Trace Height (metric)	70 micron

3M Anisotropic Conductive Film Product Selection Guide

Features and Benefits

Product Attributes

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