3M™ ACF 7303
3M™ Anisotropic Conductive Film (ACF) Adhesive 7303 is a electrically conductive, heat-bondable adhesive film. It is tacky at room temperature and is made of a thermosetting epoxy/acrylate adhesive matrix filled with conductive particles. These particles allow interconnection of circuit lines through the adhesive after bonding, but are distanced apart for the product to be electrically insulating. Heat and pressure causes the adhesive to flow and bring the circuit pads into electrical contact by trapping the conductive particles. The thermoset quickly cures. ACF 7303 can be used in bonding a flexible printed circuit to another flexible printed circuit or to a printed circuit board.
Features and Benefits
- Heat cure
- Thermo-set low temperature cure
- Tacky at room temperature
- Good thermal stability
- Reworkable
- Frozen storage
Product Attributes
| Adhesive Thickness (metric) | 74 micron |
| Adhesive Type | Epoxy/Acrylate Blend |
| Application | Electronic Component Bonding, Flex Bonding |
| Application Category | Bonding |
| Bonding Method | Thermo-compression bonding |
| Bonding Pressure | 2 MPa |
| Bonding Temperature | 135 - 150 degree C |
| Bonding Time | 25 seconds |
| Conductive Particle Size | 43 Micron |
| Conductive Particle Type | Silver-coated glass |
| Connection Type | Flex to Flex, Flex to PCB |
| Flex Type | Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester |
| Liner Thickness (metric) | 100 micron |
| Liner Type | Polyester-coated Kraft with Silicone Release |
| Minimum Gap | 10 mil |
| Minimum Gap (metric) | 250 micron |
| Minimum Overlap Area | 0.75 mm^2 |
| Minimum Pitch | 20 mil |
| Minimum Pitch (metric) | 500 Micron |
| Product Form | Roll |
| Product Series | 7303 |
| Shelf Life | 9 Months |
| Shelf Life Frozen | 18 Months |
| Standard Width (metric) | 2.5 mm, 3.0 mm, 4.0 mm, 5.0 mm |
| Tacking Pressure | 0.1 - 1.5 MPa |
| Tacking Temperature | 25 degree C |
| Tacking Time | 1 - 2 seconds |
| Total Trace Height (metric) | 140 micron |
