3M™ ECATT 9705
3M™ Electrically Conductive Adhesive Transfer Tape (ECATT) 9705 is a pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. The PSA matrix is loaded with conductive particles which provide connection between conductive materials through the adhesive(the “Z-axis”) but are distanced apart for the product to be electrically insulating in the plane of the adhesive. Tape 9705 electrically connects and adhesively bonds medium pitch flexible circuits with other flexible circuits (flex),
rigid printed circuit boards (PCB) or LCD screens. Stable electrical performance in any flexible circuit
interconnection application may require added mechanical reinforcement (clamping or compressing) in the bond area.
The PSA tack properties and lack of any thermal curing make Tape 9705 easy to use in assembly operations. Tape 9705 offers good adhesion to common PCB substrates such ascopper, gold, FR-4 epoxy, Kapton™ polyimide and polyester films.
Tape 9705 can be applied as die cut parts or in
roll form and has good adhesion to common EMI/RFI substrates such as copper, stainless steel, and smooth gasket materials.
Tape 9705 also electrically connects and adhesively bonds EMI/RFI shield and gaskets to metal frames and enclosures. The
low contact resistance and tape construction result in good EMI performance.
Features and Benefits
- Standard outgassing version of Tape 9703
- Standard adhesion acrylic adhesive
- Anisotropic Z-axis electrical conductivity
- PSA tack properties
- Thermal curing not required
- Can be applied as die-cut parts or in roll form
- Easy to use in assembly operations
Product Attributes
| Adhesive Thickness (metric) | 50 micron |
| Adhesive Type | Conductive Acrylic |
| Application | Antenna Bonding (with Grounding), EMI Shielding (with Grounding), Flex Bonding, Flex Bonding (with Grounding), Flex Stiffener Bonding (with Grounding), Grounding, Metal to Metal Bonding (with Grounding), Static Dissipation |
| Application Category | Bonding, EMI/EMC Applications |
| Bonding Method | Finger pressure or roller bar |
| Bonding Pressure | 0.03 - 0.10 MPa |
| Bonding Temperature | 20 - 35 Degree C |
| Conductive Particle Type | Silver-coated filler |
| Conductivity Direction | Z-Axis Conductive |
| Conductivity Filler Type | Particle |
| Connection Type | Flex to Flex, Flex to LCD, Flex to PCB |
| Length | 108 yd, 36 yd |
| Liner Thickness (metric) | 100 micron |
| Liner Type | Silicone Treated Polycoated Kraft Paper (PCK) |
| Minimum Gap | 15 mil |
| Minimum Gap (metric) | 400 micron |
| Minimum Overlap Area | 3.2 mm^2 |
| Minimum Pitch | 32 mil |
| Minimum Pitch (metric) | 800 Micron |
| Product Form | Roll |
| Product Series | 9705 |
| Shelf Life | 24 Months @ 21 Degree C and 50% RH |
| Total Tape Thickness without Liner | 2.0 mil |
| Total Tape Thickness without Liner (metric) | 0.05 mm |
