Solder Alloys
Selecting Solder Alloys
Solder alloys are selected for the following properties:
•Melting point
•Mechanical characteristics
•Wettability
•Abscence of Lead
About Solder
•Common solder alloys used in electronics manufacturing:
–tin-lead:Sn63Pb37 (Melting Point 183 Celsius)
–tin-silver-copper:SAC305: Sn96.5Ag3Cu0.5 (Melting Point 218 Celsius)
–tin-silver-copper:SAC305: Sn96.5Ag3Cu0.5 (Melting Point 218 Celsius)
•Alternative “lead free” alloys include:
–tin-silverSn96Ag4 (Melting Point 221 Celsius)
–tin-copper-nickelSn100C (Melting Point 227 Celsius)
Physical Forms of Solder
•Rosin Core Wire Solder (various sizes and flux types)
•Pre-Forms (custom manufactured)
•Solder Paste (spherical metal particles suspended in flux)


