3M Anisotropic Conductive Film Slideshow
3M™ Electrically Conductive Adhesive Transfer Tape (ECATT) 9705 is a pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. The PSA matrix is loaded with conductive particles which provide connection between conductive materials through the adhesive(the “Z-axis”) but are distanced apart for the product to be electrically insulating in the plane of the adhesive. Tape 9705 electrically connects and adhesively bonds medium pitch flexible circuits with other flexible circuits (flex),
rigid printed circuit boards (PCB) or LCD screens. Stable electrical performance in any flexible circuit
interconnection application may require added mechanical reinforcement (clamping or compressing) in the bond area.
The PSA tack properties and lack of any thermal curing make Tape 9705 easy to use in assembly operations. Tape 9705 offers good adhesion to common PCB substrates such ascopper, gold, FR-4 epoxy, Kapton™ polyimide and polyester films.
Tape 9705 can be applied as die cut parts or in
roll form and has good adhesion to common EMI/RFI substrates such as copper, stainless steel, and smooth gasket materials.
Tape 9705 also electrically connects and adhesively bonds EMI/RFI shield and gaskets to metal frames and enclosures. The
low contact resistance and tape construction result in good EMI performance.
Features and Benefits
- Standard outgassing version of Tape 9703
- Standard adhesion acrylic adhesive
- Anisotropic Z-axis electrical conductivity
- PSA tack properties
- Thermal curing not required
- Can be applied as die-cut parts or in roll form
- Easy to use in assembly operations
Product Attributes
| Adhesive Thickness (metric) | 50 micron |
| Adhesive Type | Conductive Acrylic |
| Application | Antenna Bonding (with Grounding), EMI Shielding (with Grounding), Flex Bonding, Flex Bonding (with Grounding), Flex Stiffener Bonding (with Grounding), Grounding, Metal to Metal Bonding (with Grounding), Static Dissipation |
| Application Category | Bonding, EMI/EMC Applications |
| Bonding Method | Finger pressure or roller bar |
| Bonding Pressure | 0.03 - 0.10 MPa |
| Bonding Temperature | 20 - 35 Degree C |
| Conductive Particle Type | Silver-coated filler |
| Conductivity Direction | Z-Axis Conductive |
| Conductivity Filler Type | Particle |
| Connection Type | Flex to Flex, Flex to LCD, Flex to PCB |
| Length | 108 yd, 36 yd |
| Liner Thickness (metric) | 100 micron |
| Liner Type | Silicone Treated Polycoated Kraft Paper (PCK) |
| Minimum Gap | 15 mil |
| Minimum Gap (metric) | 400 micron |
| Minimum Overlap Area | 3.2 mm^2 |
| Minimum Pitch | 32 mil |
| Minimum Pitch (metric) | 800 Micron |
| Product Form | Roll |
| Product Series | 9705 |
| Shelf Life | 24 Months @ 21 Degree C and 50% RH |
| Total Tape Thickness without Liner | 2.0 mil |
| Total Tape Thickness without Liner (metric) | 0.05 mm |
3M™ Electrically Conductive Adhesive Transfer Tape 9703 is a pressure sensitive adhesive (PSA) transfer tape with anisotropic electrical conductivity. The PSA matrix is loaded with conductive particles which allow interconnection between circuits through the adhesive (the “Z-axis”) but are distanced enough apart for the product to be electrically insulating. 9703 ia easy to use in assembly operations. Tape 9703 electrically connects and bonds medium pitch flexible circuits with other flexible circuits (flex), rigid printed circuit boards (PCB) or LCD screens. 9703 offers great connection to common PCB substrates such as copper, gold, FR-4 epoxy, Kapton™ polyimide and polyester films. Stable electrical performance in any flexible circuit interconnection application may require mechanical reinforcement (clamping). Tape 9703 also electrically connects and mechanically bonds EMI/RFI shield and gaskets to metal frames and enclosures. The low contact resistance and tape construction result in good EMI performance. Tape 9703 can be applied as die cut parts or in roll form and has good adhesion to common EMI/RFI substrates such as aluminum, stainless steel, and smooth gasket materials.
Features and Benefits
- Low outgassing acrylic adhesive
- Anisotropic Z-axis electrical conductivity
- PSA tack properties
- Thermal curing not required
- Easy to use in assembly operations
- Can be applied as die-cut parts or in roll form
Product Attributes
| Adhesive Thickness (metric) | 50 micron |
| Adhesive Type | Conductive Acrylic |
| Application | Antenna Bonding (with Grounding), EMI Shielding (with Grounding), Flex Bonding, Flex Bonding (with Grounding), Flex Stiffener Bonding (with Grounding), Grounding, Metal to Metal Bonding (with Grounding), Static Dissipation |
| Application Category | Bonding, EMI/EMC Applications |
| Bonding Method | Finger pressure or roller bar |
| Bonding Pressure | 0.10 MPa |
| Bonding Temperature | 15 - 70 Degree C |
| Conductive Particle Type | Silver-coated nickel |
| Conductivity Direction | Z-Axis Conductive |
| Conductivity Filler Type | Particle |
| Connection Type | Flex to Flex, Flex to LCD, Flex to PCB |
| Length | 108 yd, 36 yd |
| Liner Thickness (metric) | 100 micron |
| Liner Type | Silicone Treated Polycoated Kraft Paper (PCK) |
| Minimum Gap | 15 mil |
| Minimum Gap (metric) | 400 micron |
| Minimum Overlap Area | 3.2 mm^2 |
| Minimum Pitch | 32 mil |
| Minimum Pitch (metric) | 800 Micron |
| Product Form | Roll |
| Product Series | 9703 |
| Shelf Life | 24 Months @ 21 Degree C and 50% RH |
| Total Tape Thickness without Liner | 2.0 mil |
| Total Tape Thickness without Liner (metric) | 0.05 mm |
3M™ Anisotropic Conductive Film (ACF) 7379 is a heat-bondable, electrically conductive adhesive film. The pre-bonded film is tacky at room temp and consists of a thermoset-elastomer and thermoplastic adhesive matrix loaded with conductive particles. These particles allow connection of circuit lines through the adhesive, but are spaced apart for the product to be electrically insulating. Application of heat and pressure causes the adhesive to flow and to bring the circuit pads into contact by pinning the conductive particles. The adhesive cross-links rapidly at modest bonding temperature and pressure. The 3M ACF 7379 can be used in bonding a flexible printed circuit to glass-based devices such as displays or to another flexible printed circuit.
Features and Benefits
- Heat cure
- Thermo-set low temperature cure
- Slight tack at room temperature
- High adhesion to PET
- Good thermal stability
- Reworkable
- Frozen storage
Product Attributes
| Adhesive Thickness (metric) | 25 micron |
| Adhesive Type | Acrylate-Based |
| Application | Display Bonding |
| Application Category | Bonding |
| Bonding Method | Thermo-compression bonding |
| Bonding Pressure | 2 - 3 MPa |
| Bonding Temperature | 160 - 190 degree C |
| Bonding Time | 10 - 20 seconds |
| Conductive Particle Size | 10 Micron |
| Conductive Particle Type | Gold-coated polymer |
| Connection Type | Flex to Glass |
| Flex Type | Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester |
| Liner Thickness (metric) | 50 micron |
| Liner Type | Polyester Film with Silicone Release |
| Minimum Gap | 2 mil |
| Minimum Gap (metric) | 50 micron |
| Minimum Overlap Area | 0.05 mm^2 |
| Minimum Pitch | 4 mil |
| Minimum Pitch (metric) | 100 Micron |
| Product Form | Roll |
| Product Series | 7379 |
| Shelf Life | 4 Weeks |
| Shelf Life Frozen | 15 Months |
| Standard Width (metric) | 1.5 mm, 2.0 mm, 3.0 mm |
| Tacking Pressure | 0.1 - 1.5 MPa |
| Tacking Temperature | 60 - 90 degree C |
| Tacking Time | 1 - 2 seconds |
| Total Trace Height (metric) | 50 micron |
3M™ Anisotropic Conductive Film (ACF) 7376-30 is a electrically conductive, heat-bondable adhesive film.The unbonded film is slightly tacky at room temperature and is made of a thermoset-thermoplastic adhesive matrix filled with conductive particles.These particles provide connection of circuit lines through the adhesive thickness, but are spaced far enough apart for the product to be electrically insulating. Application of heat and pressure causes the adhesive to flow and to connect the circuit pads by pinning the conductive particles. The adhesive sets rapidly at modest bonding temperature and pressure. The 3M ACF 7376-30 is used to bond a flexible printed circuit to another flexible printed circuit or flexible printed circuit to polyester-based devices or flexible printed circuit to camera module devices.
Features and Benefits
- Heat cure
- Fast bond time
- Thermo-set low temperature cure
- Slight tack at room temperature
- 30 micron particle size
- High adhesion to PET
- Good thermal stability
- Reworkable
- Frozen storage
Product Attributes
| Adhesive Thickness (metric) | 45 micron |
| Adhesive Type | Acrylate-Based |
| Application | Camera Module Assembly |
| Application Category | Bonding |
| Bonding Method | Thermo-compression bonding |
| Bonding Pressure | 1 - 2 MPa |
| Bonding Temperature | 140 - 160 degree C |
| Bonding Time | 7 - 15 seconds |
| Conductive Particle Size | 30 Micron |
| Conductive Particle Type | Gold-coated polymer |
| Connection Type | Flex to Camera Module, Flex to Flex, Flex to PET |
| Flex Type | Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester |
| Liner Thickness (metric) | 50 micron |
| Liner Type | Polyester Film with Silicone Release |
| Minimum Gap | 4 mil |
| Minimum Gap (metric) | 100 micron |
| Minimum Overlap Area | 0.50 mm^2 |
| Product Form | Roll |
| Product Series | 7376-30 |
| Shelf Life | 4 Weeks |
| Shelf Life Frozen | 12 Months |
| Standard Width (metric) | 2.0 mm, 5.0 mm, 6.5 mm |
| Tacking Pressure | 0.1 - 1.5 MPa |
| Tacking Temperature | 60 - 90 degree C |
| Tacking Time | 1 - 2 seconds |
| Total Trace Height (metric) | 75 micron |
3M™ Anisotropic Conductive Film (ACF) 7376-10 is a electrically conductive, heat-bondable adhesive film. The unbonded film is sticky at room temperature and is made of of a thermoset-elastomer and thermoplastic adhesive matrix packed with conductive particles. These particles allow interconnection of circuits through the adhesive, but are distanced apart for the product to be electrically insulating. Heat and pressure causes the adhesive to flow and to bring the circuit pads into electrical contact by pinning the conductive particles.The adhesive cross-links quickly at modest bonding temperature and pressure. The 3M ACF 7376-10 is used in bonding a flexible printed circuit to another flexible printed circuit or flexible printed circuit to polyester-based devices or flexible printed circuit to camera module devices.
Features and Benefits
- Heat cure
- Fast bond time
- Thermo-set low temperature cure
- Slight tack at room temperature
- High adhesion to PET
- Good thermal stability
- Reworkable
- Frozen storage
Product Attributes
| Adhesive Thickness (metric) | 40 micron |
| Adhesive Type | Acrylate-Based |
| Application | Camera Module Assembly |
| Application Category | Bonding |
| Bonding Method | Thermo-compression bonding |
| Bonding Pressure | 1 - 2 MPa |
| Bonding Temperature | 140 - 160 degree C |
| Bonding Time | 7 - 15 seconds |
| Conductive Particle Size | 10 Micron |
| Conductive Particle Type | Gold-coated polymer |
| Connection Type | Flex to Camera Module, Flex to Flex, Flex to PET |
| Flex Type | Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester |
| Liner Thickness (metric) | 50 micron |
| Liner Type | Polyester Film with Silicone Release |
| Minimum Gap | 2.5 mil |
| Minimum Gap (metric) | 70 micron |
| Minimum Overlap Area | 0.10 mm^2 |
| Product Form | Roll |
| Product Series | 7376-10 |
| Shelf Life | 4 Weeks |
| Shelf Life Frozen | 12 Months |
| Standard Width (metric) | 1.5 mm, 2.0 mm, 5.5 mm, 6.5 mm, 8.0 mm |
| Tacking Pressure | 0.1 - 1.5 MPa |
| Tacking Temperature | 60 - 90 degree C |
| Tacking Time | 1 - 2 seconds |
| Total Trace Height (metric) | 75 micron |
3M™ Anisotropic Conductive Film (ACF) 7371-20 is a electrically conductive, heat-bondable adhesive film. It is has tack at room temperature and consists of a thermoset-thermoplastic adhesive matrix randomly loaded with conductive particles. These particles allow interconnection of circuits through the adhesive, but are distanced apart for the product to be electrically insulating. Heat and pressure causes the adhesive to flow and to bring the circuit pads into electrical contact by trapping the conductive particles. The adhesive cures fast at modest bonding temperature and pressure. The 3M ACF 7371-20 is used in bonding a flexible printed circuit to another flexible printed circuit or flexible printed circuit to polyester-based devices or flexible printed circuit to camera module devices.
Features and Benefits
- Heat cure
- Fast bond time
- Thermo-set low temperature cure
- Slight tack at room temperature
- 20 micron particle size
- High adhesion to PET
- Good thermal stability
- Reworkable
- Frozen storage
Product Attributes
| Adhesive Thickness (metric) | 35 micron |
| Adhesive Type | Acrylate-Based |
| Application | Touch Panel Bonding |
| Application Category | Bonding |
| Bonding Method | Thermo-compression bonding |
| Bonding Pressure | 1 - 2 MPa |
| Bonding Temperature | 140 - 160 degree C |
| Bonding Time | 10 - 15 seconds |
| Conductive Particle Size | 20 Micron |
| Conductive Particle Type | Gold-coated polymer |
| Connection Type | Flex to Flex, Flex to Glass, Flex to PET |
| Flex Type | Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester |
| Liner Thickness (metric) | 50 micron |
| Liner Type | Polyester Film with Silicone Release |
| Minimum Gap | 4 mil |
| Minimum Gap (metric) | 100 micron |
| Minimum Overlap Area | 0.50 mm^2 |
| Minimum Pitch | 8 mil |
| Minimum Pitch (metric) | 200 Micron |
| Product Form | Roll |
| Product Series | 7371-20 |
| Shelf Life | 4 Weeks |
| Shelf Life Frozen | 12 Months |
| Standard Width (metric) | 1.0 mm, 1.5 mm, 2.0 mm, 3.0 mm |
| Tacking Pressure | 0.1 - 1.5 MPa |
| Tacking Temperature | 60 - 90 degree C |
| Tacking Time | 1 - 2 seconds |
| Total Trace Height (metric) | 70 micron |
3M™ Anisotropic Conductive Film (ACF) 7371 is a electrically conductive, heat-bondable adhesive film. The unbonded film is slightly tacky at room temperature and consists of a thermoset-elastomer and thermoplastic adhesive matrix filled with conductive particles. These particles provide interconnection of circuit lines through the adhesive, but are spaced so that the product to be electrically insulating. Application of heat and pressure causes the adhesive to flow and to bring the circuit pads into contact by trapping the conductive particles. The adhesive rapidly cross-links at modest bonding temperature and pressure. 3M ACF 7371 is used in bonding a flexible printed circuit to another flexible printed circuit or to a plastic touch screen or plastic flat panel display device.
Features and Benefits
- Heat cure
- Fast bond time
- Thermo-set low temperature cure
- Slight tack at room temperature
- High adhesion to PET
- Good thermal stability
- Reworkable
- Frozen storage
Product Attributes
| Adhesive Thickness (metric) | 25 micron |
| Adhesive Type | Acrylate-Based |
| Application | Display Bonding, Touch Panel Bonding |
| Application Category | Bonding |
| Bonding Method | Thermo-compression bonding |
| Bonding Pressure | 1 - 2 MPa |
| Bonding Temperature | 140 - 170 degree C |
| Bonding Time | 10 - 15 seconds |
| Conductive Particle Size | 10 Micron |
| Conductive Particle Type | Gold-coated polymer |
| Connection Type | Flex to Flex, Flex to Glass, Flex to PET |
| Flex Type | Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester |
| Liner Thickness (metric) | 50 micron |
| Liner Type | Polyester Film with Silicone Release |
| Minimum Gap | 4 mil |
| Minimum Gap (metric) | 100 micron |
| Minimum Overlap Area | 0.10 mm^2 |
| Minimum Pitch | 8 mil |
| Minimum Pitch (metric) | 200 Micron |
| Product Form | Roll |
| Product Series | 7371 |
| Shelf Life | 4 Weeks |
| Shelf Life Frozen | 12 Months |
| Standard Width (metric) | 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm |
| Tacking Pressure | 0.1 - 1.5 MPa |
| Tacking Temperature | 60 - 90 degree C |
| Tacking Time | 1 - 2 seconds |
| Total Trace Height (metric) | 50 micron |
3M™ Anisotropic Conductive Film (ACF) Adhesive 7303 is a electrically conductive, heat-bondable adhesive film. It is tacky at room temperature and is made of a thermosetting epoxy/acrylate adhesive matrix filled with conductive particles. These particles allow interconnection of circuit lines through the adhesive after bonding, but are distanced apart for the product to be electrically insulating. Heat and pressure causes the adhesive to flow and bring the circuit pads into electrical contact by trapping the conductive particles. The thermoset quickly cures. ACF 7303 can be used in bonding a flexible printed circuit to another flexible printed circuit or to a printed circuit board.
Features and Benefits
- Heat cure
- Thermo-set low temperature cure
- Tacky at room temperature
- Good thermal stability
- Reworkable
- Frozen storage
Product Attributes
| Adhesive Thickness (metric) | 74 micron |
| Adhesive Type | Epoxy/Acrylate Blend |
| Application | Electronic Component Bonding, Flex Bonding |
| Application Category | Bonding |
| Bonding Method | Thermo-compression bonding |
| Bonding Pressure | 2 MPa |
| Bonding Temperature | 135 - 150 degree C |
| Bonding Time | 25 seconds |
| Conductive Particle Size | 43 Micron |
| Conductive Particle Type | Silver-coated glass |
| Connection Type | Flex to Flex, Flex to PCB |
| Flex Type | Gold/Copper on Polyester, Gold/Copper on Polyimide, Silver Ink on Polyester |
| Liner Thickness (metric) | 100 micron |
| Liner Type | Polyester-coated Kraft with Silicone Release |
| Minimum Gap | 10 mil |
| Minimum Gap (metric) | 250 micron |
| Minimum Overlap Area | 0.75 mm^2 |
| Minimum Pitch | 20 mil |
| Minimum Pitch (metric) | 500 Micron |
| Product Form | Roll |
| Product Series | 7303 |
| Shelf Life | 9 Months |
| Shelf Life Frozen | 18 Months |
| Standard Width (metric) | 2.5 mm, 3.0 mm, 4.0 mm, 5.0 mm |
| Tacking Pressure | 0.1 - 1.5 MPa |
| Tacking Temperature | 25 degree C |
| Tacking Time | 1 - 2 seconds |
| Total Trace Height (metric) | 140 micron |
3M™ Anisotropic Conductive Film (ACF) 5363 is a electrically conductive, heat-bondable adhesive film. At room temperature the unbonded film is non-tacky and consists of a thermoset-thermoplastic adhesive matrix filled with conductive particles. These particles provide inter-connection of circuit lines through the adhesive thickness, but are spaced a certain distance apart for the product to be electrically insulating in the plane of the adhesive. Heat and pressure causes the adhesive to flow and to bring the circuit pads into electrical contact by trapping the conductive particles. The adhesive cures quickly at modest bonding temperature. The 3M ACF 5363 may be used in bonding a flexible printed circuit to another flexible printed circuit or to a printed circuit board.
Features and Benefits
- Heat cure
- Fast bond time
- Thermo-set high temperature cure
- Excellent chemical resistance
- Highest thermal stability
- Replaces solder for lead-free solution
- Frozen storage
Product Attributes
| Adhesive Thickness (metric) | 40 micron |
| Adhesive Type | Thermoset Epoxy |
| Application | Electronic Component Bonding, Flex Bonding |
| Application Category | Bonding |
| Bonding Method | Thermo-compression bonding |
| Bonding Pressure | 3 - 5 MPa |
| Bonding Temperature | 190 - 210 degree C |
| Bonding Time | 10 seconds |
| Conductive Particle Size | 10 Micron |
| Conductive Particle Type | Gold-coated Ni |
| Connection Type | Flex to Flex, Flex to PCB |
| Flex Type | Gold/Copper on Polyimide |
| Liner Thickness (metric) | 50 micron |
| Liner Type | Polyester Film with Silicone Release |
| Minimum Gap | 4 mil |
| Minimum Gap (metric) | 100 micron |
| Minimum Overlap Area | 0.15 mm^2 |
| Minimum Pitch | 8 mil |
| Minimum Pitch (metric) | 200 Micron |
| Product Form | Roll |
| Product Series | 5363 |
| Shelf Life | 4 Weeks |
| Shelf Life Frozen | 15 Months |
| Standard Width (metric) | 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm |
| Tacking Pressure | 0.1 - 1.5 MPa |
| Tacking Temperature | 90 - 110 degree C |
| Tacking Time | 1 - 2 seconds |
| Total Trace Height (metric) | 75 micron |
Design requirements have been used in the development of these 3M™ Anisotropic Conductive Film Adhesive products. The products were developed for use in a wide range of applications. The following graphics and table offer some guidelines useful in choosing the correct product.
