3M Anisotropic Conductive Film Slideshow
3M™ Anisotropic Conductive Film Adhesives (ACF) are based on adhesive designs that are categorized into four product families. These categories include pressure sensitive adhesives (PSA), thermoplastic materials, thermoset materials, and a combination of a PSA and thermoset. The following graphics show these different product families and the grouping of products within each and showing a general comparison of performance ranking and process simplicity is added showing one level of trade-off necessary in the product selection process.
The following descriptions provide general, high-level, key product characteristics for
the individual 3M ACFs.
• 3M Film 5363 - Flex-to-Board (or -to-Flex) excellent reliability with polyimide flex, 200μm pitch, 200°C bond temperature, 10 sec bond cycle, high peel strength, max use temperature 125°C.
• 3M Film 7379 - Flex-to-Glass (or -to-Flex) Thermo-set low temperature cure. High adhesion to PET. Good thermal stability. 3M recommends that users consider testing 5363 for improved results.
• 3M Film 7303 - Flex-to-Board (or -to-Flex) ideal for polyester flex, 135°C bond temperature, 500μm pitch, stable interconnect resistance, max use temperature 80°C.
• 3M Film 7371 - Flex-to-Flex, Flex-to-Glass, Flex-to-PET. Slight tack at room temperature. High adhesion to PET. Fast bond time.
• 3M Film 7371-20 - Flex-to-Flex, Flex-to-Glass, Flex-to-PET. Slight tack at room temperature. High adhesion to PET. Fast bond time. 20 micron particle size.
• 3M Film 7376-10 - Flex to Camera Module, Flex to Flex, Flex to PET. An acrylate-based adhesive system filled with 10 micron gold-coated polymer particles.
• 3M Film 7376-30 - Flex to Camera Module, Flex to Flex, Flex to PET. An acrylate-based adhesive system filled with 30 micron gold-coated polymer particles.
• 3M Film 9703/9705 - Flex-to-Board (or -to-Flex) PSA rapid bond, coarse pitch, max use temperature 70°C, (additional pressure support necessary for some applications).
| Application | Bonding Temperature (°C) |
Bonding Time (sec) |
Bonding Pressure (MPa) |
Particle Diameter (μ) |
Adhesive Thickness (μ) |
Pitch Minimum (μ) |
Minimum Pad Area (sq mm) |
Connection Resistance (mOhms) |
90° Peel Adhesion (g/cm) |
Temp/Humidity Aging (°C/%rh) |
Temp Cycling (°C) |
|
| ACF 5363 | Flex to Flex, Flex to PCB | 190 - 210 | 10 | 3 - 5 | 10 | 40 | 200 | 0.15 | <100 | <700 | ||
| ACF 7371 | Flex on Plastic/Glass | 140 - 170 | 10 - 15 | 1-2 | 10 | 25 | 200 | 0.2 | <100 | <700 | 85/85 | -40 to 85 |
| ACF 7303 | Flex to Flex, Flex to PCB | 135 - 150 | 25 | 2 | 43 | 74 | 500 | 0.75 | <200 | <500 | ||
| ACF 7371-20 | Touch panel | 140 - 170 | 10 - 15 | 1-2 | 20 | 35 | 500 | 0.5 | <20 | <600 | 85/85 | -40 to 85 |
| ACF 7376-10 | Camera module | 140 - 160 | 7 - 15 | 1-2 | 10 | 40 | 200 | 0.1 | <20 | <900 | 85/85 | -40 to 85 |
| ACF 7376-30 | Camera module | 140 - 160 | 7 - 15 | 1-2 | 30 | 45 | 500 | 0.5 | <20 | <700 | 85/85 | -40 to 85 |
| ACF 7379 | Glass | 160 - 190 | 10 - 20 | 1-2 | 10 | 25 | 100 | 0.05 | <3000 | <700 | 85/85 | -40 to 85 |
| ACF 9703/9705 | EMI/EMC Applications | 15 - 70 | 0.10 | 50 | 800 | 3.2 | 60/95 | -40 to 85 |
| Flex Type | Connection Type | ||||||
| Silver Ink on Polyester | Gold/Copper on Polyester | Gold/Copper on Polyimide | Flex to Glass | Flex to Plastic Device | Flex to PCB | Flex to Flex | |
| ACF 5363 | x | x | x | ||||
| ACF 7303 | x | x | x | x | x | x | |
| ACF 7371 | x | x | x | x | x | ||
| ACF 7371-20 | x | x | x | x | x | ||
| ACF 7376-10 | x | x | x | x | x | x | |
| ACF 7376-30 | x | x | x | x | x | x | |
| ACF 7379 | x | x | x | ||||
| ACF 9703/9705 | x | x | x | ||||
